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| HD74LS08 Quadruple 2-Input Positive AND Gates REJ03D0394-0200 Rev.2.00 Feb.18.2005 Features * Ordering Information Part Name HD74LS08P HD74LS08FPEL HD74LS08RPEL Package Type DILP-14 pin SOP-14 pin (JEITA) SOP-14 pin (JEDEC) Package Code (Previous Code) PRDP0014AB-B (DP-14AV) PRSP0014DF-B (FP-14DAV) PRSP0014DE-A (FP-14DNV) Package Abbreviation P FP RP Taping Abbreviation (Quantity) -- EL (2,000 pcs/reel) EL (2,500 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement 1A 1B 1Y 2A 2B 2Y GND 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC 4B 4A 4Y 3B 3A 3Y (Top view) Rev.2.00, Feb.18.2005, page 1 of 5 HD74LS08 Circuit Schematic (1/4) VCC 20k 10k 8k 75 Inputs A 4.5k B 1.5k 3k Output Y GND Absolute Maximum Ratings Item Supply voltage Input voltage Symbol VCC Note VIN Ratings 7 7 Unit V V mW C Power dissipation PT 400 Storage temperature Tstg -65 to +150 Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Symbol VCC IOH IOL Topr Min 4.75 -- -- -20 Typ 5.00 -- -- 25 Max 5.25 -400 8 75 Unit V A mA C Rev.2.00, Feb.18.2005, page 2 of 5 HD74LS08 Electrical Characteristics (Ta = -20 to +75 C) Item Input voltage Symbol VIH VIL VOH VOL IIH IIL II Short-circuit output current Supply current IOS ICCH ICCL min. 2.0 -- 2.7 -- -- -- -- -- -20 -- -- -- typ.* -- -- -- -- -- -- -- -- -- 2.4 4.4 -- max. -- 0.8 -- 0.5 0.4 20 -0.4 0.1 -100 4.8 8.8 -1.5 Unit V V V V A mA mA mA mA mA V Condition Output voltage Input current VCC = 4.75 V, VIH = 2 V, IOH = -400 A IOL = 8 mA VCC = 4.75 V, VIL = 0.8 V IOL = 4 mA VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VCC = 5.25 V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = -18 mA Input clamp voltage VIK Note: * VCC = 5 V, Ta = 25C Switching Characteristics (VCC = 5 V, Ta = 25C) Item Propagation delay time Symbol tPLH tPHL min. -- -- typ. 8 10 max. 15 20 Unit ns ns Condition CL = 15 pF, RL = 2 k Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)". Rev.2.00, Feb.18.2005, page 3 of 5 HD74LS08 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B Previous Code DP-14AV MASS[Typ.] 0.97g D 14 8 1 b3 7 Z E Reference Symbol Dimension in Millimeters Min Nom 7.62 19.2 6.3 20.32 7.4 5.06 0.51 0.40 0.48 1.30 0.19 0 2.29 2.54 0.25 0.31 15 2.79 2.39 2.54 0.56 Max A A1 e1 D E L A A1 bp e bp e1 c b3 c e Z ( Ni/Pd/Au plating ) L JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B Previous Code FP-14DAV MASS[Typ.] 0.23g *1 D 8 F NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 14 bp HE E Index mark *2 c Reference Symbol Dimension in Millimeters Min Nom 10.06 5.50 Max 10.5 Terminal cross section ( Ni/Pd/Au plating ) 1 Z e *3 D E A2 A1 0.00 7 bp x M L1 0.10 0.20 2.20 A bp b1 c c 1 0.34 0.40 0.46 0.15 0.20 0.25 A HE 0 7.50 7.80 1.27 8 8.00 A1 y L e x y 0.12 0.15 1.42 0.50 1 Detail F Z L L 0.70 1.15 0.90 Rev.2.00, Feb.18.2005, page 4 of 5 HD74LS08 JEITA Package Code P-SOP14-3.95x8.65-1.27 RENESAS Code PRSP0014DE-A Previous Code FP-14DNV MASS[Typ.] 0.13g *1 D 8 F 14 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. bp *2 Index mark HE E c Reference Symbol Dimension in Millimeters Min Nom 8.65 3.95 Max 9.05 Terminal cross section ( Ni/Pd/Au plating ) 1 Z e *3 D E A2 7 bp x M L1 A1 A bp b1 c c 1 0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 A HE 0 5.80 6.10 1.27 8 6.20 A1 L e x y 0.25 0.15 0.635 0.40 1 y Detail F Z L L 0.60 1.08 1.27 Rev.2.00, Feb.18.2005, page 5 of 5 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 http://www.renesas.com (c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .2.0 |
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